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请问做完包皮手术后一定要做半导体激光治疗
健康咨询描述：
请问做完包皮手术后一定要做半导体激光治疗吗不做行不行啊因为那个好贵我现在的阴茎感觉很肿刚做完手术一天今天做了一次那个想不做了不知行不行有什么办法能消肿呢
曾经的治疗情况和效果：
做的包皮手术
想得到怎样的帮助：怎样治疗水肿
其他类似问题
医生回复区
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帮助网友：1447称赞：53
&&&&&&病情分析：&&&&&&你好，包皮术后要注意服用抗生素预防感染&&&&&&指导意见：&&&&&&对于半导体激光治疗可以根据自己的情况选择做不做，这个你可以和医生沟通
还有就是包皮切口有的地方挺整齐的但是有一个地方好像是肿了的包皮挺大一块是因为没切好还是怎么回事啊
20:20医生回答：
那个地方应该就是手术缝线打结的地方，所以会冒得高一些
帮助网友：443称赞：3
&&&&&&病情分析：&&&&&&半导体激光治疗？？？，只是一个辅助治疗，刚做完手术，肯定会有水肿期的阶段。&&&&&&指导意见：&&&&&&你可以白天多饮水，到晚上少饮水，因为晚上饮水多了会增加勃起次数，然后引起水肿。现在不要饮酒，饮用辛辣的食物。
擅长: 妇科,泌尿外科
帮助网友：35740称赞：1215
&&&&&&病情分析：&&&&&&你好，可以不进行物理治疗，随着时间的增长会自行消肿　所以不要过于担心。&&&&&&指导意见：&&&&&&术后一周是需要服用抗感染药物的，避免吃辛辣刺激的食物　避免剧烈运动，定期复查，尽量穿宽松衣服减少对伤口的摩擦，祝早日康复！
&&&&&&以上是对“请问做完包皮手术后一定要做半导体激光治疗”这个问题的建议，希望对您有帮助，祝您健康！
还有就是包皮切口有的地方挺整齐的但是有一个地方好像是肿了的包皮挺大一块是因为没切好还是怎么回事啊
20:09医生回答：
这个是由于水肿所致的，没事，定期复查就可以的。
( 专业名称：包皮环切术
别称：割包皮手术、包皮
平均费用：1324元
包皮过长可使污垢、细菌存留，导致龟头发炎，妨碍性生活的和谐，需要行包皮环切术进行治疗。所谓包皮环切术是指将阴茎上多余的包皮进行切除，使原本被...
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下载APP，免费快速问医生北京大学 | 日-7月15日
2016年北京大学“硅基光电子技术及应用”暑期学校
暑期学校合影 PKU-NTU
2016年暑期学校授课老师(Update In Progress)
Qiming Wang
Biography王启明，中国科学院院士，光电子学家。1956年毕业于复旦大学物理系。中国科学院半导体研究所研究员，曾任该所所长。目前主要从事半导体光电子器件物理、光子集成及其在光网络通信中的应用，尤其关注硅基光子器件和硅基光电子集成的发展。
Zhiping ZhouPeking University
Silicon Photonics and Its Applications
硅基光电子学及其应用
Silicon Photonics has demonstrated itself as a more efficient and lower cost on-chip optical solution for high speed optical communications, datacenter interconnections, and sensing technology. It is expected that a successful monolithic integration of silicon based photonic devices and microelectronic devices will lead to a significant "micro optoelectronics revolution". This lecture will start with an introduction to Silicon Photonics and its short history. After a brief description of the fundamental theories, the potential applications and a future outlook will be discussed and presented.
Recent Progresses in Silicon Photonics and Microsystem Lab
硅基光电子及微系统实验室的最新进展
Silicon Photonics and Microsystem Lab was established 11 years ago and has been focused on research and development of Silicon Potonics ever since. Its ultimate goal is to develop the next generation of compactly integrated low cost optoelectronic systems that may be used for real time sensing/detection, high-density data communications, and high-speed control/actuation. Specific research scope includes but not limited to CMOS compatible light sources, modulators, detectors, sub-wavelength grating devices, beam splitters, rotators, photonic crystal devices, surface plasmonic devices, integrated optical sensors, integrated communication systems, etc. This lecture will describe some highlights of the Lab, but more will be focused on the recent progresses in all aspect of the scope.
Zhiping (James) Zhou (周治平) received his Ph.D. (EE) degree from Georgia Institute of Technology (GT), USA, in 1993. From 1993 to 2005, he was with the Microelectronics Research Center at GT, where he engaged research and development in the are nanophotonic ultra-fast op integr semiconductor and vector rigorous diffraction analysis. He is now a “Changjiang” Professor at Peking University, Beijing, China, focusing on silicon photonics and microsystems research and development. He has been credited for over 400 technical papers and presentations.
He is a Fellow of OSA, SPIE, and IET. He serves as Director of Chinese Optical Society (COS) and Chinese Society for Optical Engineering (CSOE), the funding Editor-in-Chief of Photonics Research, and is on OSA Board of Editors. He was funding Chair of IEEE Wuhan Section, , Director of IEEE Atlanta Section, . He also chaired, co-chaired, and served on many program committees for various conferences for IEEE Photonics Society, OSA, SPIE, COS, and CSOE.
Siming Chen
University College London
Lin YangInstitute of Semiconductors, CAS
Title: 用于光互连与光计算的硅基光子器件及集成
随着CPU主频的提高和处理核数目的增多，需要更高的通信带宽来实现处理核间的通信。电互连所固有的缺点（高功耗、低带宽及高延迟）使其成为制约处理核间通信的主要瓶颈。国际半导体技术发展路线图明确指出，需要尽快找到替代电互连的方案。在处理核间采用光互连将成为趋势，硅基光子集成是实现处理核间光互连的基础。硅基激光器、光调制器、复用/解复用器与光波导构成片上光互连网络的基本光学链路，而光学路由器是用于片上光互连网络节点数据交换的器件。本报告第一部分将介绍国际上硅基光学路由器和硅基光调制器的研究现状以及我们在上述两个方面的研究工作。
另一方面，海量数据处理中的大多数运算都是矩阵运算，光信号由于本征的并行和高带宽特性，非常适合矩阵运算。传统光学矩阵处理器通过透镜等体光学元件实现，体积大、功耗高、扩展性差。硅基微纳光电子器件体积小、功耗低、与CMOS工艺兼容。如何实现传统光学矩阵处理器与硅基微纳光电子器件结合，在硅片上实现光学矩阵处理器，是当前光计算领域一个亟待解决的重大科学技术问题。本报告第二部分将介绍我们在硅基集成光学矩阵处理器方面的研究工作。
Biography:
杨林，男，1973年9月生，研究员，博士生导师。2003年6月毕业于中国科学院半导体研究所集成光电子学国家联合重点实验室，获微电子学与固体电子学博士学位。2003年8月赴日本北海道大学集成量子电子学中心留学，历任研究机关研究员和日本学术振兴会研究员。2007年9月入选中国科学院“百人计划”，2013年6月终期评估被评为“优秀”，现为中国科学院半导体研究所集成光电子学国家联合重点实验室研究员。
主持和承担了中科院“百人计划”、国家自然科学重点基金、国家“863”等多个项目。获授权中国发明专利21项，申请中国发明专利20余项，发表SCI收录论文60余篇，在国际学术会议上作邀请报告三十余次。
Baoqin Chen
Institute of Microelectronics, CAS
Micro- Lithography, Electron Beam Lithography and Standardization
TechnologyCurrently Intel is leading IC production to 22 nm node while SMIC is in 45 nm and developing the process for 14-28 nm IC production. Representing with demonstration on 22 nm circuits and devices, research institutes and universities in China are working on process technology of nanometer CMOS, including sub-20 nm IC technology. EBL is the absolute lithography process step for 22 nm or below IC technology as EUVL (Extreme Ultraviolet Lithography ) and MEBL (Multiple Electron Beam Lithography)are not available currently in China. With very high resolution EBL is dominated in nanometer IC research while its low writing speed prohibits its application in IC production. Mix & Match is one of the solution to combine the high efficiency of optical lithography and high resolution of EBL, that is patterns of nanometer structures is written with EBL while other patterns is written with optical lithography. There are some issues in EBL applications, e.g. proximity effect caused by scattering charging caused by insulato drifting caused by electron beam column, developing process, magnetic field and temperature of environment, collapse of structures with high-aspect-ratio in nanometer scale, and developing high resolution resist with high contrast,
etc. In China there are two committees regarding micro-lithography standization, one is Technical Sub-Committee of Micro-Lithography of National Standardization Technology Committee for Semiconductor Equipments and Materials, another is Micro-Nano-fabrication Group of Standardization Technology Committee for Nanometer Sciences. Both organizations are working on applying international standards of micro-lithography to IC industry and research field in China.
Baoqin Chen (陈宝钦), male. born in 1942, graduated from Dept. of Physics of Peking University in 1966. worked for Institute of Semiconductor of Chinese Academy of Sciences from 1968 to 1985. He has worked for Institute of Microelectronics of Chinese Academy of Sciences since 1985. He is professor and mentor of PhD student both for Institute of Microelectronics of Chinese Academy of Sciences and University of Chinese Academy of Sciences. His concurrent posts are vice director of National Standardization Technical Committee for Semiconductor Equipment and Materials. secretary-general of sub-committee of Micro-lithography . vice secretary-general of group of Micro&Nano-fabrication technology of National Standardization Technical Committee for Nano Science and Technology. vice director of Semiconductor Committee of Beijing Electronics Society. director of sub-committee of photomask of Beijing Electronics Society. director of Association of Senior Scientists and Technicians of Chinese Academy of Sciences. director of sub-committee of Microelectronics. Main research fields are mask-making, electron beam lithography, micro&nano fabrication and micro-lithography.
Institute of Semiconductors, CAS
Junbo FengChina Electronics Technology Group Corporation
Fabrication and Packaging Technologies of Silicon Photonics
硅基光电子器件制备与封装技术
Silicon photonics is currently at the same early stage of development as microelectronics was in the 1970s. Due to the special requirements andimmaturecomponent libraries,the designers must own some basic understanding of fabrication and packagingat the very beginning of scheme.The most attractive aspects of photonicson silicon arethe low primary cost of the material, the mature processing techniques, andthe potential for straightforward integration with electrical componentsin the same substrate. Even silicon photonics is always claimed to be CMOS compatible, every attempt to directly integratephotonic functionality into the advanced CMOSline so far, without making anyprocess changes, has yielded poorly-performing devices or economic waste. Some special technologies (e.g. Ge on Si) are important in silicon photonics devices. Also, the large refractive index contrast of silicon photonics makes the coupling between silicon waveguide and outside world, for example single-mode fiber and semiconductor laser chip, a challenging work.
In this course，we do not attempt to offer a comprehensive review of micro fabrication technologies, but rather to introduce thespecial requirements and most importantfabrication processes involved in silicon photonics. After that, state-of-the-art packaging technologies and design rules of silicon photonics are introduced.
Biography:
Junbo Feng(冯俊波) received the B.E. and Ph.D. degrees from Huazhong University of Science and Technology, China in 2004 and 2009, respectively. He is currently a senior engineer in the 38th institute of China Electronics Technology Group Corporation (CETC38). His research topics focus on silicon photonics and optical integration technologies. He studied in the electronic engineering department of Georgia Tech. during 8.06. After that, he continued his research in Peking University and became a post doctor in Tsinghua University until 2011. He has authored more than 20 journal and conference publications and a book chapter, owned more than 10 patents. He presided over 5 national and provincial projects in the past five years.
Nanjian WuInstitute of Semiconductors,
Title: CMOS人工视觉系统芯片
CMOS人工视觉系统芯片集成了高速图像传感器和大规模并行图像处理电路，能够模仿人类视觉系统视觉信息并行处理机制，克服了现有视觉图像系统中数据串行传输和串行处理的速度限制瓶颈问题，实现了图像获取和图像信息处理每秒一千帧的系统速度，可广泛应用于高速图像处理、快速图像识别解释、高速运动目标的实时追踪等国防和民用领域。报告将介绍：1）视觉成像的历史；2）CMOS图像传感器设计和应用的现状；3）CMOS人工视觉系统芯片的最新研究成果等。
Biography:
吴南健，中国科学院"百人计划"研究员，兼中国科学院大学教授和中国科技大学教授。一九九二年获日本国立电气通信大学电子工程系理学博士。一九九二年起分别任日本国立北海道大学助教、国立电气通信大学副教授。二零零零年起任中国科学院半导体研究所研究员，中国科学院研究生院教授。二零零九年起任日本静冈大学荣誉客席教授。主要从事高速图像传感器、图像并行处理芯片、高速视觉片上系统芯片和极低功耗模拟射频集成电路等设计研究工作。在国外内外学术杂志和国际会议发表论文200余篇，申请或取得专利100余项。负责和领导设计完成芯片40余款。
Lin ZhangTianjin University
Mr. Ignazio Piacentini
ficonTEC GmbH
Automating the packaging and testing of photonics
integrated circuits to lower overall cost and increase yields
Comparing the cost of packaging of conventional CMOS chips with that of PICs, we will discover a staggering difference: 10-12 % for the former, and rising up to 80% for the latter. Testing PICs as single dies, bars or full wafers, with both electrical and optical probing is also a challenge. How PICS production numbers will escalate is a hotly debated topic, but whenever that will happen, advanced automation in assembly and testing will play a major role in keeping the cost at bay. Ensuring high yields on manual assembly line is also a difficult task, while automated processes can also
provide data relevant to production quality, grading of the devices, and actual yields.
ficonTEC is a machine manufacturer entirely dedicated to photonics and the lecture will present the state of the art and the next steps for full volume manufacturing, illustrating also the major ‘ingredients’ of a typical machine and providing some background of the major technologies such as motion control, machine vision, instrumentation and application software.
Biography:
Ignazio Piacentini has recently taken up the position of Director of Business Development at ficonTEC GmbH in Achim, Germany, after heading the Photonics Devices Assembly Business Unit at PI miCos GmbH (PI Group).
Previous to that, he directed ImagingLabSrl, in Lodi (Italy) an engineering / consulting company specialized in machine vision and advanced robotics. He held the position of Business Development Manager Europe for imaging and motion of National Instruments (Austin, TX) from 1999 to 2003.
He has a B.Sc. in Nuclear Engineering (Milan, Italy, 1975) and a M.Sc. degree in Digital Systems and Instrumentation (Polytechnic of Central London, UK, 1987).
Before joining the machine vision industry in the early nineties, he has spent many years working for the European Commission (Euratom) designing control and data acquisition systems for the thermonuclear fusion research community, with a long spell at the JET project (Culham Labs, UK). In more recent years he was selected as an ‘external expert’ consultant for ITER (a large scale thermonuclear experimental project) working on Remote Handling Control System issues, Viewing equipment, Virtual and Augmented Reality, and 3D Vision and Metrology.
He has served two consecutive mandates as a member of the Board of Directors of EMVA (European Machine Vision Association).
CunZheng Ning
Arizona State University and Tsinghua University
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